Samsung and SK Hynix are reportedly set to begin mass production of sixth-generation high-bandwidth memory chips (HBM4) in 2026. The AI-optimised memory is expected to first roll out from Samsung in February, followed by SK Hynix around September, with much of the output earmarked for Nvidia’s Vera Rubin AI accelerators. Neither company’s HBM4 is likely to reach c…Samsung and SK Hynix are reportedly set to begin mass production of sixth-generation high-bandwidth memory chips (HBM4) in 2026. The AI-optimised memory is expected to first roll out from Samsung in February, followed by SK Hynix around September, with much of the output earmarked for Nvidia’s Vera Rubin AI accelerators. Neither company’s HBM4 is likely to reach c…