Samsung Electronics is reportedly developing a new glass substrate for advanced semiconductor packaging. Due to ever-increasing demand for AI chips, the South Korean firm is exploring the use of glass interposers instead of silicon interposers, to cut manufacturing costs and boost performance. Samsung is reportedly focusing on smaller panel prototypes, prioritising an…Samsung Electronics is reportedly developing a new glass substrate for advanced semiconductor packaging. Due to ever-increasing demand for AI chips, the South Korean firm is exploring the use of glass interposers instead of silicon interposers, to cut manufacturing costs and boost performance. Samsung is reportedly focusing on smaller panel prototypes, prioritising an…
