Intel has unveiled more details about its upcoming Panther Lake chip, officially called Intel Core Ultra series 3. Built using the 18A process at its Arizona facility, it will feature a multi-chiplet SoC design, RibbonFET transistors, and Foveros packaging. The processor promises 50% faster performance, improved efficiency, and 180 TOPS AI capability.Intel has unveiled more details about its upcoming Panther Lake chip, officially called Intel Core Ultra series 3. Built using the 18A process at its Arizona facility, it will feature a multi-chiplet SoC design, RibbonFET transistors, and Foveros packaging. The processor promises 50% faster performance, improved efficiency, and 180 TOPS AI capability.